Abstract:W-10Cu and W-20Cu composite materials were prepared by direct mechanical alloying and oxide co-reduction methods, respectively. The effects of W powder particle size, sintering temperature, and holding time on the microstructure, density, and conductivity of W-Cu alloy were studied. The results show that with the increase of W powder particle size, the W grain size in the W-Cu alloy prepared by direct mechanical alloying method increases gradually, the density drops gradually, and the conductivity increases gradually. Under the same sintering conditions, compared to the direct mechanical alloying method, the W-Cu alloys prepared by the oxide co-reduction method has smaller W grain size, uniform distribution, higher density and conductivity. With the increases of sintering temperature, the W grain size in the W-Cu alloy increases gradually, the density and conductivity increase gradually. When the sintering temperature increases from 1 500 ℃ to 1 600 ℃, the average grain size of W in W-10Cu alloy prepared by oxide co-reduction method increases from 2.1 μm to 3.6 μm, the density increases from 98.2% to 98.5%, and the conductivity increases from 39.3% IACS to 39.8% IACS. The average grain size of W in W-20Cu alloy increases from 2.3 μm to 3.5 μm, the density increases from 98.4% to 99.2%, and the conductivity increases from 40.8% IACS to 41.6% IACS. In addition, the W grain size in the microstructure of W-Cu alloy increases gradually with the increase of holding time.